JPH0121272Y2 - - Google Patents

Info

Publication number

JPH0121272Y2

JPH0121272Y2 JP18636084U JP18636084U JPH0121272Y2 JP H0121272 Y2 JPH0121272 Y2 JP H0121272Y2 JP 18636084 U JP18636084 U JP 18636084U JP 18636084 U JP18636084 U JP 18636084U JP H0121272 Y2 JPH0121272 Y2 JP H0121272Y2

Authority

JP

Japan

Prior art keywords

socket

insulating gasket

spring

insulating

spigot

Prior art date

1984-12-07

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 239000012212 insulator Substances 0.000 claims description 10
• 230000035882 stress Effects 0.000 description 8
• 238000009413 insulation Methods 0.000 description 6
• 230000006835 compression Effects 0.000 description 3
• 238000007906 compression Methods 0.000 description 3
• 238000010586 diagram Methods 0.000 description 3
• 239000012530 fluid Substances 0.000 description 3
• 229920002379 silicone rubber Polymers 0.000 description 3
• 239000004945 silicone rubber Substances 0.000 description 3
• 238000003466 welding Methods 0.000 description 3
• SZUVGFMDDVSKSI-WIFOCOSTSA-N (1s,2s,3s,5r)-1-(carboxymethyl)-3,5-bis[(4-phenoxyphenyl)methyl-propylcarbamoyl]cyclopentane-1,2-dicarboxylic acid Chemical compound O=C([C@@H]1[C@@H]([C@](CC(O)=O)([C@H](C(=O)N(CCC)CC=2C=CC(OC=3C=CC=CC=3)=CC=2)C1)C(O)=O)C(O)=O)N(CCC)CC(C=C1)=CC=C1OC1=CC=CC=C1 SZUVGFMDDVSKSI-WIFOCOSTSA-N 0.000 description 2
• 229940126543 compound 14 Drugs 0.000 description 2
• 150000001875 compounds Chemical class 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 239000000463 material Substances 0.000 description 2
• 229910052751 metal Inorganic materials 0.000 description 2
• 239000002184 metal Substances 0.000 description 2
• 238000000034 method Methods 0.000 description 2
• 230000008646 thermal stress Effects 0.000 description 2
• GLGNXYJARSMNGJ-VKTIVEEGSA-N (1s,2s,3r,4r)-3-[[5-chloro-2-[(1-ethyl-6-methoxy-2-oxo-4,5-dihydro-3h-1-benzazepin-7-yl)amino]pyrimidin-4-yl]amino]bicyclo[2.2.1]hept-5-ene-2-carboxamide Chemical compound CCN1C(=O)CCCC2=C(OC)C(NC=3N=C(C(=CN=3)Cl)N[C@H]3[C@H]([C@@]4([H])C[C@@]3(C=C4)[H])C(N)=O)=CC=C21 GLGNXYJARSMNGJ-VKTIVEEGSA-N 0.000 description 1
• 239000004593 Epoxy Substances 0.000 description 1
• 239000003795 chemical substances by application Substances 0.000 description 1
• 229940125904 compound 1 Drugs 0.000 description 1
• 229940125758 compound 15 Drugs 0.000 description 1
• 238000010292 electrical insulation Methods 0.000 description 1
• 230000001747 exhibiting effect Effects 0.000 description 1
• 239000004519 grease Substances 0.000 description 1
• 238000002347 injection Methods 0.000 description 1
• 239000007924 injection Substances 0.000 description 1
• 239000011810 insulating material Substances 0.000 description 1
• 230000007774 longterm Effects 0.000 description 1
• 239000000314 lubricant Substances 0.000 description 1
• 230000004048 modification Effects 0.000 description 1
• 238000012986 modification Methods 0.000 description 1
• CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
• 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
• 239000000615 nonconductor Substances 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1
• 239000007787 solid Substances 0.000 description 1